Moto X 2016 Update: Equipped with Internal Heat Pipe to Avoid Overheating; To Sport Snapdragon 810?

This is undoubtedly true that we do not possess a lot of information from chassis alone, but it has been reported that there is a heat pipe which is embedded internally to the upcoming Moto X 2016. This is for the readers' information that a heat pipe is a very common component of PC that helps in transferring heat from one source to another, which can also be termed typically as a processor or a power supply.

There may be a couple of possibilities due to which Motorola is introducing the heat pipe in its about to be launched model. The possibilities are:

The model is less likely to use the Snapdragon 810 which had heating issues earlier.

Motorolo would probably want to be safe than being sorry as they are aware of the fact that the chipset they use produces excessive heat, and thus to avoid any harmful effects, they have introduced the heat pipe.

Another very interesting piece of information is that the speaker holes which are in the bottom of the phone match up with the rear facing speaker holes that was told in the previous leak. The rumors may not be 100 percent legitimate on the final design for the Moto X 2016, but some of the discussed specs out here would certainly be there. The smartphone users are very keen in waiting for this model of Motorola to be launched this year and we hope the users have a great experience using this phone.