Apple is on track for its iPhone 7 and 7 Plus release date plans as large-scale production of the various components to be used with the 2016 iOS flagship devices are set to start soon, new reports said. Asian suppliers of the tech giant are ramping up on their readiness to assemble the next-generation iPhone.
Among the players mentioned in a new DigiTimes report are Taiwan Semiconductor Manufacturing Company (TSMC), Cirrus Logic and Analog Devices. The three have been reportedly contracted by Apple to supply the key inner components of both the iPhone 7 and 7 Plus.
As reported earlier, TSMC will be responsible for the application processor that will power the next iPhone. The Taiwanese chipmaker is said to monopolize the manufacture of the A10 chip as Apple has reportedly favor the firm over Samsung due to the former's cost-effective and better technology.
It was suggested too that with TSMC solely handling the A10 mass production duties, both the iPhone 7 and 7 Plus will be slightly slimmer and lighter than their predecessors.
And aside from TSMC's involvement providing hints on the look, build, specs and features of the sequel to the iPhone 6S, Apple Insider said on its report that other suppliers point to a window for users to have a peek on the how the next iPhone will end up.
For instance, "Cirrus Logic and Analog Devices will play a significant role in allowing the iPhone 7 to be even thinner than the current iPhone 6s design," the report said.
And not only the 2016 iPhones will be further trimmed down but they will also be equipped with a dual-lens camera system, which likely will be similar to the rear shooting system that just debuted with the LG G5. These driver components will be exclusive to the jumbo-size iPhone 7 Plus and will be delivered by Analog Devices, Apple Insider added on its report.
The 7 Plus is also said to rock high-end shooting features such as optical zoom and optical image stabilization, the report said.
Also part of the camera upgrade are notable cosmetic alterations like the ditching of the protruding main camera lens due to the use of a better technology courtesy of the suppliers mentioned above. The next iPhone is also believe to do away with the antenna bands that break the clean and smooth rear finish of the device.
It is unclear though if the iPhone back plate revision will impact on the wireless connectivity features of the device.
Going by the past models, the iPhone 7 and 7 Plus release date is not expected until fall this 2016 but Apple is scheduled to intro a smaller device, the 4-inch iPhone 5SE, this coming March alongside the iPad Air 3 and possibly a model or two of the MacBook Pro and Air 2016 lineup.