Rumors persist that the iPhone 7 release date is but a minor bump from the iPhone 6S, the two handsets nearly identical in numerous aspects. Speculations are rife that it is the next iPhone to come out in 2017 that's jam-packed with killer feature upgrades - all-glass build/design, OLED display and a more powerful and faster A11 processing chip, among them.
The latest word from Asia, where the iPhone is assembled, indicate that Apple will tap its longtime manufacturing partner Foxconn in creating the device that will mark the 10th anniversary of the smartphone that redefined the industry. And the collaboration will again produce an all-glass handset that is reminiscent of the iPhone 4 and 4S.
Citing a report first published by Nikkei of Japan, MacRumors said that Foxconn has been tasked to develop the new glass chassis for the iPhone that will roll out in 2017. The label for the device has yet to be mentioned though most expect it to be the iPhone 8 or the actual iPhone 7 if rumors will prove correct that this 2016 it will be an iPhone 6SE release.
At the same time, the Taiwan-based iPhone assembler has already commence work on the supposed OLED or AMOLED panel that Apple will use for the device, which would mark the tech giant's switch from Retina LCD to the display panel that Samsung first popularized.
Sharp was mentioned in the same MacRumors report as key OLED supplier but earlier rumors on the matter also nominated LG, Japan Display and Samsung.
OLED becoming part of the iPhone supply chain is seen as another killer innovation from the Cupertino-based tech giant. In employing the screen technology, Apple is believed to deliver a new iPhone that will sport an edge-to-edge screen that is free of any visible control buttons.
The home key with its Touch ID fingerprint sensor mechanism, speaker phone and camera sensor will either be embedded or integrated with the 2017 iPhone display panel that is envisioned to taper off or wraparound the edges.
And firing up the iPhone of 2017 is the A11 chip that will make use of the 10-nanometer manufacturing, making it more powerful, faster and energy efficient than the A10 processing chip that is tipped as the main engine for the iPhone 7. In a new report, Apple Insider said that TSMC will be the chief supplier of A11 SoC for the 2017 iPhone that will make use of "InFO (integrated fan-out) and WLP (wafer-level packaging) technology."
But it remains likely that Apple will award a small portion of its 2017 iPhone processing chip contract to Samsung, the report added.
As the iPhone 7 release date is expected to happen in September 2016, the next iPhone launch in 2017 is likely set to take place at around the same time next year.