Following the Galaxy S7 battery mishap, Samsung is gearing towards a colossal smartphone that will involve the highly-anticipated Galaxy S8. Now, the South Korean tech giant revealed new information regarding the device's RAM module, which will be powered by SK Hynix's 8GB mobile chipset.
SK Hynix recently announced its latest DDR4X RAM chip, which integrates two 8 Gigabit pieces connected in a dual-channel config and stacked in four layers. According to University Herald, the new 8GB DDR4X RAM chip claims that it consumes 20 percent less power than competing LPDDR4 modules, as the data input/output can run at 0.6V compared to the 1.1V standard.
With the new memory chips already ready for future smartphone flagships, rumors claim that Samsung's upcoming Galaxy S8 smartphone might feature the said chipset. If rumors are to be believed, a single 8GB Low Power Double Data Rate (LPDDR4X) RAM module could improve the Galaxy S8's workflows as it can process 34.1GB of data per second, WCCFTech reported.
Through a smaller blueprint of 12mm x 12.7mm and thickness of less than 1mm incorporated in SK Hynix's new chip, Samsung Galaxy S8 models will have greater flexibility in reducing its overall thickness, leaving extra room for a larger battery.
Senior Vice President Jonghoon Oh, the Head of DRAM Product Development Division, said, "SK Hynix would help mobile device users maximize their experiences. The Company plans to expand the usage of the product to various applications such as high end laptops and automotive electronics as well as mobile gadgets."
The Low Power Double Data Rate 4X chip is considered as the world's highest density of 8GB and is reportedly 20 percent more power efficient and 30 percent smaller in physical size than the current LPDDR4 module used in the Galaxy S7 and Galaxy S7 edge.
Reports suggest that the new chip will be fueled with Qualcomm's Snapdragon 835 SoC, which is also smaller in size and has improved performance compared to its predecessor. The SoC chipset sports an Adreno 540 graphics processing module, which offers superior graphics performance.
As of press time, no official announcement from Samsung has revealed the said integration, although SK Hynix could expect high demand for 8GB DRAM chips as they become a popular feature in upcoming smartphones, high-end laptops and automotive electronics.