There are rumors that the upcoming Samsung Galaxy S7 release will happen in February 2016 and it will boast stellar camera specs.
Samsung Galaxy S7 is expected to be released at the World Mobile Congress, which will be held on Feb. 22, 2016, according to iDigital Times. Codenamed as "Project Lucky," the device is expected to be power packed with many high end features, according to SamMobile.
It is expected to come in two variants. One of them will sport a flat surface, while the other will sport a curved surface. Both of these variants will feature a screen resolution of 4K, which is extremely rare keeping in mind the current standards.
The display size of the screen will be 5.5 inches for both of them, with a screen resolution of 2560 x 1440 pixels. This implies that the device will support 808 ppi for the 5.5 inches of screen display. The device is also expected to feature either 3 GB or 4 GB RAM. It is also expected to feature a 20 mega pixel rear camera, equipped with the ISOCELL technology.
Recent reports suggest that Samsung is planning to use two different processing chipsets for this device. The Galaxy S7 might be equipped with the Exynos 8890 chip along with the Qualcomm Snapdragon 820. The combination will make the device to run really fast, with minimum heat loss.
It is also rumored that Samsung is in the process of developing a new version of UFS 2.0 storage, which will be a form of expandable storage. The current flagship Samsung model does not feature any expandable source of memory. UFS 2.0 can really step up the game for Samsung in this regard.