South Korean tech giant Samsung Electronics is reportedly planning to launch its latest Samsung Galaxy S7 smartphone in four different versions: the Galaxy S7, Galaxy S7 plus, Galaxy S7 edge, and Galaxy S7 edge Plus.
The Samsung Galaxy S7 lineup will become official during the upcoming Mobile World Congress (MWC) 2016 event, which will take place in February in Barcelona, Spain, according to GSM Arena.
In terms of the design and features, the Galaxy S7 is rumored to sport a magnesium alloy construction and will feature either a 16 or a 12 megapixel rear-facing camera with a 1/2.0" sensor. It measures 143.37 x 70.8 x 6.94 mm in dimensions.
Alongside the Galaxy S7 lineup, Samsung is expected to introduce its latest Exynos 8890 processor. The company plans to use both an Exynos chipset and Qualcomm's Snapdragon 820 processor on its Galaxy S7 handset.
As for the Galaxy S7 Plus, it is rumored to sport a 6.0-inch phablet size display screen and measures 163.32 x 82.01 x 7.82mm in dimensions. In comparison with the previous Galaxy S6, the S7 Plus will have curvier metal frame, USwitch reported.
Also, new information from China claims Samsung had partnered with Synaptics on the ClearForce technology, which could take on Apple's 3D Touch. If the information is accurate, Samsung might be planning to utilize the ClearForce technology on its Galaxy S7, however, it's unclear how the company will develop the software behind it.
Other specs the Galaxy S7 is rumored to have include a Sabre 9018AQ2M audio chip which was developed by ESS Technology. This chip will offer Galaxy S7 users with superior Hi-Fi audio quality. Since there's still no confirmation on the above specs and features, it should be taken with a grain of salt.