With many smartphone makers gearing up for their flagship launches in 2016, the SoC manufactures too are going ahead with their latest chipsets. (Photo : YouTube)
With many smartphone makers gearing up for their flagship launches in 2016, the SoC manufactures too are going ahead with their latest chipsets.
SoC manufacturer MediaTek, well known for its upper mid-range CPUs, seems to be working on its new line of chipsets, with Helio X12 on its way on introducing a ton of new exciting features.
The MediaTek Helio X12 is seen as an upgraded version to its current Helio X10, and will compete against Samsung's Exynos 7422 and Sanpdragon 618/620. Following features are expected to be a part of MediaTek Helio X12:
1. True 64Bit Octa-Core A53, 2.53GHz
2. 5GBps USB 3.1 Gen1 (OTG)
3. Dual Channel 933MHz LPDDR3, eMMC 5.1
4. 4K 30fps HDR Video Recording
5. 10Bit 4K Video Playback
6. External Wi-Fi, Bluetooth, FM Radio & GNSS
7. Wi-Fi Calling, LTE Cat.6, World Mode (CDMA 2K), VoLTE
8. 14/14 Primary/Diversity RX Ports, 2x20CA
9. API Support: Open CL 1.2, Open GL ES 3.2, Vulkan
The improved aspects of the Helio X12 over Helio X10 are found below:
1. Supports 14 LTE Bands, in comparison to Helio X10 that supports 8 LTE Bands.
2. Supports Wi-Fi calling and VoLTE with the same external wireless SoC.
3. Same RAM, but upgraded storage.
4. Faster USB
5. Slightly Higher Clock speeds
6. Early Benchmark Scores: ~1100 (GeekBench Single), ~55000 (AnTuTu) and ~5600 (GeekBench Multi).
From latest reports, it looks like Xiaomi will be releasing a new 5-inch device featuring the MediaTek HX12 chipset, and the device might perhaps be Redmi Note 3 or completely a new one in their line of production.
