Qualcomm (Photo : Reuters)
South Korean smartphone manufacturer LG Electronics Inc. released a statement on Jan. 22, Thursday, denying allegations that its latest series of smartphone using the Qualcomm Snapdragon 810 processor are not overheating contrary to Samsung's claim.
The problem originated after Samsung dropped Qualcomm's Snapdragon 810 processor upon grounds that it radiates too much heat and could pose serious repercussion to its smartphones. Samsung's original plan was to integrate the Qualcomm chip to its Galaxy S6 which is expected to ship out sometime this year, according to Arstechnica.
Seoul-based tech analyst Song Myung Sup said "Samsung may release the next Galaxy S as early as March, and it can't dare to take the risk to use any of the chips in question for its most important model."
Qualcomm's share fell by 1.2 percent on the New York Stock Exchange after Samsung dropped its Snapdragon 810 chip, according to Bloomberg.
Despite Samsung's claim of overheating chips, LG Electronics will still get on with its original plan of integrating its Flex 2 smartphone with Qualcomm's chip. Many tech analysts speculate that either Samsung's overheating problem might be related to a different aspect of its design or Qualcomm has released a fix in order to stabilize the Snapdragon 810.
LG vice president for mobile product planning Woo Ram-chan said, "I am very much aware of the various concerns in the market about the (Snapdragon 810), but the chip's performance is quite satisfactory."
Many tech reviews said that the LG Flex 2 G using the Snapdragon 810 does not overheat. LG's newest smartphone is scheduled to be released in South Korea on Jan. 30.
The Qualcomm Snapdragon 810 is a 20nm SOC equipped with the latest DX 11.2 GPU and an H.265 codec. The chip is an octa-core processor composed of two clusters, a quad-core Cortex A57 and a quad-core Cortex A53.
