iPhone 7 will have a different chassis compared to iPhone 6s. (Photo : REUTERS)
There are rumors that the much-anticipated Apple iPhone 7 may be the thinnest and fastest iPhone till date.
iPhone 6S and iPhone 6S Plus were revealed at the recently held Apple media event. However, there seems to be more anticipation about the iPhone 7, according to iDigital Times. This device is rumored to be really thin and extremely sleek, beating Apple's own standards.
It could come at a thickness of 6.5 mm, which is really low, according toApple Insider. Despite being the thinnest iPhone, Apple is rumored to use a strong material for the chassis in order to avoid any "bend-gate issues." There are also rumors that the upcoming Apple iPhone 7 will pack the latest technology and be a force to reckon with in the smartphone domain.
Other rumored features claimed that the device may include an A10 chipset. This will not only make the device extremely fast, but it will also make less susceptible in overheating. It is further rumored that Apple is already in the process of placing the orders for the various parts of iPhone 7.
It is also being said that the exclusive contract to manufacture the A10 chipset for iPhone 7 is given to Taiwan Semiconductor Manufacturing Company. They are planning to manufacture the chipset at a dimension of 16 nm.
The device will be equipped with the latest Force Touch ID technology. It is expected to come in three variants. Apple iPhone 7 is also expected to have a new chassis with SideWalls Display, 12 MP iSight Camera and 2 GB RAM, according to PC Advisor.
