Poster depicting the rumored specs of Apple iPhone 7. (Photo : YouTube / Top10Media)
There are rumors that iPhone 7 is packed with an Intel Chipset and a waterproof chassis.
iPhone 7 was announced at the Apple event held on Sept. 9. The much awaited device is reportedly opting to use Intel chipset instead of Qualcomm chipset, according to Forbes.
It is also reported that the team at Intel is working pretty hard at assembling the 7360 LTE modern chip for iPhone 7, according to Mac Rumors. Apple CEO Tim Cook is yet to confirm on the choice of chipset for iPhone 7. The phone is expected to be full of innovation and provide a new and enhanced user experience to the customers.
It is also rumored that the gadget will be sporting a different chassis. It will sport a water proof chassis along with a strengthened frame. This is in contrast to other conventional aluminum metal casing found in iPhone devices. Another change which is expected to be included in iPhone 7 is the feature of glass on glass touch panels. This will make it possible for iPhone 7 to be slimmer and also much lighter than iPhone 6.
It is further rumored that iPhone 7 might stick to the screen size between 4.7 - 5.5 inches. It is also rumored to replace the physical home button with a virtual home button. This sensor will be easily spotted in the form of a tiny Apple logo.
Another change which could be possibly seen in the device is in the handling of the SIM card. It is rumored that iPhone 7 will not require a SIM card altogether. The device will take care of the services provided in the SIM on its own. This will be a first of its kind feature to be found in a smart device.
