Leaks are now coming out of what’s in store for the future Samsung Galaxy handset iteration, the Samsung Galaxy S7. (Photo : YouTube/Mrwhosetheboss)
Samsung is already slated for a major launch event scheduled on Aug. 13 to which the company is expected to unveil its latest devices. However, a new set of leaked documents reveal that the South Korean tech giant has already laid its plans for 2016 and shows that it is working on the Galaxy S7 smartphone widely considered as the successor to its flagship device.
The leak was first picked up by Phone Arena and shows that Samsung is planning to thrown in top of line hardware for the Galaxy S7. It seems that Samsung is working to reestablish Qualcomm as its major supplier of chipset of its devices.
If these rumors are true, the next Samsung device might contain a Qualcomm chipset to which the company dropped in favor of its own Exynos chipset. Samsung ceased integrating Qualcomm chips on its devices after allegations of major overheating problems.
The leak revealed that Samsung is experimenting with the latest Snapdragon 820 chipset from Qualcomm. The Galaxy S7, codenamed Jungfrau, is being developed through a new project management process known only as Agile.
The Qualcomm Snapdragon 820 chipset is believed to sport a quad-core CPU and an Adreno 530 graphics processing unit. It also features the MDM9x55 LTE Cat.10 modem and will be manufactured using the FinFET process utilizing either Samsung's 14nm or TSMC's 16nm fabrication technology.
With these information surfacing on the Internet, many tech analysts predict that the S7 will be unveiled early in 2016 if not in the latter part of 2015, according to GSM Arena.
If the Agile management process will live up to its moniker, Samsung might be able to deliver a new device before the start of the 2016 Mobile World Congress which usually opens in the first quarter of each year.
